A Review on Thermal Management and Heat Dissipation
A literature review is presented on energy consumption and heat transfer in recent fifth-generation (5G) antennas in network base stations.
Therefore, it is of great importance to reduce the operation temperature of the chips to attain higher operation efficiency of 5G base stations. The thermal interface material (TIM) between the chip and the heat sink is the key component to improve the thermal dissipation .
In addition, these PCN films have good flame-retardancy and retain electrical insulation even at the phase transition temperature. The core–sheath PCNs significantly enhance the heat dissipation of 5G base station chips, avoiding the automatic under-clocking of the chips due to overheating.
Currently, the majority of research concerning heat dissipation in 5G base stations is primarily focusing on passive cooling methods. Today, there is a clear gap in the literature in terms of research investigations that tend to quantify the temperature performances in 5G electronic devices.
The PCN exhibits intensively potential applications in the thermal management of 5G base stations and thermoelectric generators. Thermal management has become a crucial problem for high-power-density equipment and devices.
A literature review is presented on energy consumption and heat transfer in recent fifth-generation (5G) antennas in network base stations.
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